Moogukasa The use of components of BGA technology needs that companies carry out a complete monitoring of the process to assure the welding quality. The X-ray images were executed in the studied company. The f and techniques used were the qualitative-quantitative approach, conducted by the case study technique in the welding process of the BGA component by collecting cross section and X-ray and data analysis alignment, cracks and voids within the process. Amazon Drive Cloud storage from Amazon.
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Moogukasa The use of components of BGA technology needs that companies carry out a complete monitoring of the process to assure the welding quality. The X-ray images were executed in the studied company. The f and techniques used were the qualitative-quantitative approach, conducted by the case study technique in the welding process of the BGA component by collecting cross section and X-ray and data analysis alignment, cracks and voids within the process.
Amazon Drive Cloud storage from Amazon. View shipping rates and policies Average Customer Review: This article aimed to conduct an analysis of the quality of the Reflow of soldering in exchange of component of BGA technology. Printing of Welding Paste, procedure of welding paste application, assembly of the component Place Component and welding in a re-fusion furnace. Voids are seen in thru-hole and other surface mount joints.
There were considered data of involved costs regarding two sceneries: Before proceeding with our next revision to IPCwe will conduct a survey, and you can help shape the next revision. One of the unintentional consequences of this migration is that the industry had to request new methods for the welding of components in the boards; this comes in one moment in which the industry of semiconductors is developing components continually smaller and accommodating higher functionalities . Therefore, voids generally are not detected.
Taking into account the data i-iii verified in the cross-section analysis of the BGA component according to the criteria of acceptability presented in Figure 6it is possible to affirm that the weld join analyzed was found in compliance with the Standards IPC-A and IPCB, therefore, it can be said that the process of welding in the BGA exchange fulfills the international concepts of quality. Robson Marques Costa, e-mail: The voids of the welded balls after the component exchange were verified using the X-ray.
Your answers will be summarized. Processes of SMT assembly lines usually involve welding paste, placement of components and the operations of Reflow Welding . Welding joins breakage is one of the main failure manners due to an inadequate lead-free reflow welding process . If you participate in the survey, we will provide you with a summary of answers from industry colleagues regarding the use of BGA components.
As previously affirmed, the normal process to accomplish the reworking is to try to emulate the Reflow profile production for the individual component to be substituted . Results of the survey will help organize the amendment being discussed for IPC B. The research is justified based on the need of a diagnosis of the welding process in the implantation phase, because the use of materials and processes exempt of lead, also conduces to new concerns with the quality , becoming this type of research indispensable for any organization that tries to offer to their customers a quality product, avoiding thus that the company assumes reliability risks of their products when offer them in the market.
About the Stages For the case study, a literature review on the fundamental concepts related to the topic was used, searching recent papers on similar applications and International Technical Standards IPC-TOE and IPCB, to diagnose the acceptance of the welding of the component type studied. In the cases in that the BGA component presents a defect, for the accomplishment of the change of the component, it is used a specific Station of Change of BGA, so that the placement of the component is more accurate.
Amazon Inspire Digital Educational Resources. Services on Demand Article. Starting from this year, the usage of one of the components more used in welding, lead, would not be more used in electronic welding due to this legislation. The IPC committee decided that because it is possible to minimize voids, but almost impossible to eliminate them, it was reasonable to set a limit on acceptance criteria that can be met easily using sensible process parameters. BGA is used in several types of components, among them, chipsets and memory chips.
Among alternatives without lead, the lead-free welding SnAgCu is a substitute thoroughly accepted, due to its best fluency, its fatigues resistance and its microstructural stability . Many issues have become especially important due to the change in the alloys of the ball, the ball shape, and the attachment procedures. The BGA component is an example thoroughly used in printed circuit boards by a process of reflow welding, which is one of the critical items in Surface Mount Technology.
The quality of unions and welding materials, and its adaptation for a certain application should be verified . It is a component type where the contact terminals are spheres. Explore the Home Gift Guide. Based on this data, some people have advocated that voids are good for reliability. ComiXology Thousands of Digital Comics. IPC serves to the industry of electronic, specifically to the manufacturers related with the process of Printed Boards with acceptability patterns internationally accepted .
Conclusions On the basis of the analysis of the results presented in Figure 5it is possible to affirm that the company could perform the exchange process of a BGA component, inserted in the process of manufacture of notebooks, without risk in the final quality of the product, because the study of cross-section carried out in the BGA demonstrated that the executed process of welding attend the criteria of acceptability of International Standards IPC-AE and IPCB, therefore, it can be concluded that there is quality in the welding process of the exchange of the component of BGA technology.
As mentioned, even though we released this document, we met at APEX to discuss its revision; and this is an opportunity for you to get involved. In the period from April 01 to May 31,the acquisition of data verified that the amount of this model of produced Notebooks reached the total of 16, PCI MB and BGAs were changed, corresponding to an index of 1.
It is also necessary to verify the adaptation of the assembly components. Duringthe company in study went through a migration from Tin-Lead Welding Technology to Lead-Free Welding, assisting an international demand; however, this transition worsens the process problems because the lead-free welding is usually harder and more brittle than conventional lead and tin welds . Most 10 Related.
IPC 7095 C PDF
Dijas It is also necessary to verify the adaptation of the assembly components. Yin, Case Study Research: Write a customer review. This process should also be carried through a controlled temperature profile to pic defects in the welding of Balls. Duringthe company in study went through a migration from Tin-Lead Welding Technology to Lead-Free Welding, assisting an international demand; however, this transition worsens the process problems because the lead-free welding is usually harder and more brittle than conventional lead and tin welds . Analysis of the quality of the welding process in the exchange of component of BGA technology Amazon Advertising Find, attract, and engage customers.
IPC-7095C: Design and Assembly Process Implementation for BGAs