LM2876 DATASHEET PDF

Faejin For the design of a heat datashet for your audio amplifier appli. This says that once fu GBWP is known for an amplifier. Total Harmonic Distortion Plus Noise. Although the optional external components have specific. Integrated circuits have additional open loop gain allowing.

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Under-Voltage Protection: Upon system power-up the under-voltage protection circuitry allows the power supplies and their corresponding caps to come up close to their full values before turning on the LM such that no DC output spikes occur. Upon turn-off, the output of the LM is brought to ground before the power supplies such that no transients occur at power-down. Over-Voltage Protection: The LM contains overvolt- age protection circuitry that limits the output current to ap- proximately 4Apeak while also providing voltage clamping, though not through internal clamping diodes.

The clamping effect is quite the same, however, the output transistors are designed to work alternately by sinking large current spikes. SPiKe Protection: The LM is protected from instanta- neous peak-temperature stressing by the power transistor array. The waveform to the right of the SOA graph exempli- fies how the dynamic protection will cause waveform distor- tion when enabled. Thermal Protection: The LM has a sophisticated ther- mal protection scheme to prevent long-term thermal stress to the device.

This greatly reduces the stress imposed on the IC by thermal cycling, which in turn improves its reliability under sustained fault conditions. Since the die temperature is directly dependent upon the heat sink, the heat sink should be chosen as discussed in the Thermal Considerations section, such that thermal shutdown will not be reached during normal operation. Using the best heat sink possible within the cost and space con- straints of the system will improve the long-term reliability of any power semiconductor device.

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